Terminals > Ring-Terminals > Heat-Shrink-Ring-Terminals > Heat-Shrink,-Solder-&-Crimp
NSPA MLF116-14L, Lead-Free Heat Shrink, Crimp, & Solder Ring Terminal, 1/4", Red, 22-18 Ga (10 MIN)



Item:   971145LF

Product Group: Ring Terminals
Product Type: Shrink Tube, Solder & Crimp Ring Terminals
Insulation Material: Heat Shrink
Termination Type: Crimp, Solder & Heat Shrink
Size: 1/4" Stud
Temperature Range: -67°F to 230°F (-55°C to 110°C)
Wire Range: 22-18 Ga
Standards: RoHS

Price
1+ I Ext. Price I 100+ I Ext. Price I 1000+ I Ext. Price
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Package
In Stock
1.34600 I 13.46 I 1.09700 I 109.70 I 0.80 I 800.00
10 EA






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