Terminals > Ring-Terminals > Heat-Shrink-Ring-Terminals > Heat-Shrink,-Solder-&-Crimp
NSPA MLF110-12L, Lead-Free Heat Shrink, Crimp, & Solder Ring Terminal, 1/2" Stud, Yellow, 12-10 Ga (10 MIN)



Item:   973125LF

Product Group: Ring Terminals
Product Type: Heat Shrink, Crimp & Solder Ring Terminals
Insulation Material: Heat Shrink
Termination Type: Crimp, Solder & Heat Shrink
Size: 1/2" Stud
Temperature Range: 230°F
Wire Range: 12-10 Ga

Price
1+ I Ext. Price I 100+ I Ext. Price I 1000+ I Ext. Price
Qty in
Package 		In Stock
1.67700 I 16.77 I 1.35600 I 135.60 I 0.97200 I 972.00
10 EA ✓






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