NSPA MLF56-20, Lead-Free Heat Shrink, Crimp, & Solder Step-Down Butt Connector, 26-24/22-18 Ga (10 MIN)
Item: 931110LF
Product Specifications
- Insulation Material
- Heat Shrink
- Termination Type
- Crimp, Solder & Heat Shrink
- Temperature Range
- -67°F to 230°F (-55°C to 110°C)
- Wire Range
- 26-24/22-18 Ga
- Standards
- RoHS
