NSPA MLF110-12L, Lead-Free Heat Shrink, Crimp, & Solder Ring Terminal, 1/2" Stud, Yellow, 12-10 Ga (10 MIN)
Item: 973125LF
Product Specifications
- Insulation Material
- Heat Shrink
- Termination Type
- Crimp, Solder & Heat Shrink
- Size/Diameter
- 1/2" Stud
- Temperature Range
- 230°F
- Wire Range
- 12-10 Ga
