NSPA MLF110-14L, Lead-Free Heat Shrink, Crimp, & Solder Ring Terminal, 1/4", Yellow, 12-10 Ga (10 MIN)
Item: 973145LF
Product Specifications
- Insulation Material
- Heat Shrink
- Termination Type
- Crimp, Solder & Heat Shrink
- Size/Diameter
- 1/4" Stud
- Temperature Range
- -67°F to 230°F (-55°C to 110°C)
- Wire Range
- 12-10 Ga
- Standards
- RoHS
