NSPA MLF116-06L, Lead-Free Heat Shrink, Crimp, & Solder Ring Terminal, 6 Stud, Red, 22-18 Ga (10 MIN)
Item: 971065LF
Product Specifications
- Insulation Material
- Heat Shrink
- Termination Type
- Solder & Heat Shrink
- Size/Diameter
- 6 Stud
- Temperature Range
- 230°F
- Wire Range
- 22-18 Ga