NSPA MLF116-14L, Lead-Free Heat Shrink, Crimp, & Solder Ring Terminal, 1/4", Red, 22-18 Ga (10 MIN)
Item: 971145LF
Product Specifications
- Insulation Material
- Heat Shrink
- Termination Type
- Crimp, Solder & Heat Shrink
- Size/Diameter
- 1/4" Stud
- Temperature Range
- -67°F to 230°F (-55°C to 110°C)
- Wire Range
- 22-18 Ga
- Standards
- RoHS
