Terminals > Push!On-Terminals > Heat-Shrink-Push!On-Terminals > Heat-Shrink,-Solder-&-Crimp-Push!On-Terminals
NSPA MLF6-18-250FF, Lead-Free Heat Shrink, Crimp, & Solder Fully Ins. Female Terminal, .250", Red, 22-18 Ga (10 MIN)



Item:   977715LF

Product Group: Push-On Terminals
Product Type: Heat Shrink, Solder, & Crimp Push-On Terminals
Insulation Material: Heat Shrink
Termination Type: Crimp, Solder & Heat Shrink
Size: 0.250"
Temperature Range: -67°F to 230°F (-55°C to 110°C)
Wire Range: 22-18 Ga
Standards: RoHS

Price
1+ I Ext. Price I 100+ I Ext. Price I 1000+ I Ext. Price
Qty in
Package
In Stock
1.45900 I 14.59 I 1.18 I 118.00 I 0.86100 I 861.00
10 EA






Qty: